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Buckling Analysis of an Orthotropic Layer Bonded to a Substrate with an Interface Crack

Jeong, K. M. / Beom, H. G.

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Buckling Analysis of an Orthotropic Layer Bonded to a Substrate with an Interface Crack

Jeong, K. M. / Beom, H. G.

Buckling Analysis of an Orthotropic Layer Bonded to a Substrate with an Interface Crack

Jeong, K. M. / Beom, H. G.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Buckling Analysis of an Orthotropic Layer Bonded to a Substrate with an Interface Crack

Contributors:

Jeong, K. M. (author) / Beom, H. G. (author)

Published in:

JOURNAL OF COMPOSITE MATERIALS ; 37 ; 1613-1628

Publication date:

2003-01-01

Size:

16 pages

ISSN:

0021-9983

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.118

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