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A platform for research: civil engineering, architecture and urbanism
Molecular dynamics simulation of healing of an ellipsoid crack in copper under compressive stress
Molecular dynamics simulation of healing of an ellipsoid crack in copper under compressive stress
Molecular dynamics simulation of healing of an ellipsoid crack in copper under compressive stress
Li, M. (author) / Chu, W. Y. (author) / Gao, K. W. (author) / Qiao, L. J. (author)
MATERIALS LETTERS ; 58 ; 543-546
2004-01-01
4 pages
Article (Journal)
English
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