A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Next-generation Packaging Materials New Developments in Board/Package Materials and Processes
Next-generation Packaging Materials New Developments in Board/Package Materials and Processes
Next-generation Packaging Materials New Developments in Board/Package Materials and Processes
Tummala, R. (author) / Raj, P. M. (author) / Sundaram, V. (author)
ADVANCED PACKAGING ; 13 ; 26-33
2004-01-01
8 pages
Article (Journal)
English
DDC:
658.564
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Materials and Processes: Making Next Generation Designs Possible
British Library Online Contents | 2012
Guest Editorial Developments in Thermal Materials and Processes for Semiconductor Packaging
| British Library Online Contents | 2005
New Corrosion-Resistant Materials Enable Next-Generation Energy Processes
| British Library Online Contents | 2011
Rigid Plastics Packaging - Materials, Processes and Applications
| British Library Online Contents | 2002
Next generation display technology:Polymers and Soft Materials
| British Library Online Contents | 2009