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    Nondestructive Evaluation of Adhesively Bonded Joints Using Ultrasonic Technique

    New search for: Yi, W.
    New search for: Jang, C. S.
    New search for: Han, J. Y.
    New search for: Kim, M. G.
    New search for: Lee, S.-S.
    New search for: Yoon, D.-J.
    New search for: Lee, J.-H.
    New search for: Lee, S.

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    Nondestructive Evaluation of Adhesively Bonded Joints Using Ultrasonic Technique

    New search for: Yi, W.
    New search for: Jang, C. S.
    New search for: Han, J. Y.
    New search for: Kim, M. G.
    New search for: Lee, S.-S.
    New search for: Yoon, D.-J.
    New search for: Lee, J.-H.
    New search for: Lee, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Nondestructive Evaluation of Adhesively Bonded Joints Using Ultrasonic Technique

    New search for: Yi, W.
    New search for: Jang, C. S.
    New search for: Han, J. Y.
    New search for: Kim, M. G.
    New search for: Lee, S.-S.
    New search for: Yoon, D.-J.
    New search for: Lee, J.-H.
    New search for: Lee, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
    Title:

    Nondestructive Evaluation of Adhesively Bonded Joints Using Ultrasonic Technique

    Contributors:

    Yi, W. (author) / Jang, C. S. (author) / Han, J. Y. (author) / Kim, M. G. (author) / Lee, S.-S. / Yoon, D.-J. / Lee, J.-H. / Lee, S.

    Published in:

    Advances in Nondestructive Evaluation Part 3 Proceedings of the 11^t^h Asian Pacific Conference on Nondestructive Testing, Jeju Island, Korea, 3-7 November 2003 ; 1833-1838

    KEY ENGINEERING MATERIALS

    Publication date:

    2004-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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