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    Reflow Characteristics of Copper in an Oxygen Ambient

    New search for: Kim, S. H.
    New search for: Kim, D. W.
    New search for: Lee, S.-S.
    New search for: Yoon, D.-J.
    New search for: Lee, J.-H.
    New search for: Lee, S.

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    Reflow Characteristics of Copper in an Oxygen Ambient

    New search for: Kim, S. H.
    New search for: Kim, D. W.
    New search for: Lee, S.-S.
    New search for: Yoon, D.-J.
    New search for: Lee, J.-H.
    New search for: Lee, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Reflow Characteristics of Copper in an Oxygen Ambient

    New search for: Kim, S. H.
    New search for: Kim, D. W.
    New search for: Lee, S.-S.
    New search for: Yoon, D.-J.
    New search for: Lee, J.-H.
    New search for: Lee, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Reflow Characteristics of Copper in an Oxygen Ambient

    Contributors:

    Kim, S. H. (author) / Kim, D. W. (author) / Lee, S.-S. / Yoon, D.-J. / Lee, J.-H. / Lee, S.

    Published in:

    Advances in Nondestructive Evaluation Part 1 Proceedings of the 11^t^h Asian Pacific Conference on Nondestructive Testing, Jeju Island, Korea, 3-7 November 2003 ; 820-825

    KEY ENGINEERING MATERIALS ; 270/273

    Publication date:

    2004-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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