Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer: Fid-Bau Portal

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

Su, J. X. / Guo, D. M. / Kang, R. K. / Jin, Z. J. / Li, X. J. / Tian, Y. B.

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Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

Su, J. X. / Guo, D. M. / Kang, R. K. / Jin, Z. J. / Li, X. J. / Tian, Y. B.

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

Su, J. X. / Guo, D. M. / Kang, R. K. / Jin, Z. J. / Li, X. J. / Tian, Y. B.

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Document information

Title:

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

Contributors:

Su, J. X. (author) / Guo, D. M. (author) / Kang, R. K. (author) / Jin, Z. J. (author) / Li, X. J. (author) / Tian, Y. B. (author) / Ai, X. / Li, J. / Huang, C.

Published in:

Advances in Materials Manufacturing Science and Technology ; 26-31

MATERIALS SCIENCE FORUM ; 471/472

Publication date:

2004-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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