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    Microstructure and room temperature hardening of ultra-fine-grained oxide-dispersion strengthened copper prepared by cryomilling

    New search for: Kudashov, D. V.
    New search for: Baum, H.
    New search for: Martin, U.
    New search for: Heilmaier, M.
    New search for: Oettel, H.

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    Microstructure and room temperature hardening of ultra-fine-grained oxide-dispersion strengthened copper prepared by cryomilling

    New search for: Kudashov, D. V.
    New search for: Baum, H.
    New search for: Martin, U.
    New search for: Heilmaier, M.
    New search for: Oettel, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure and room temperature hardening of ultra-fine-grained oxide-dispersion strengthened copper prepared by cryomilling

    New search for: Kudashov, D. V.
    New search for: Baum, H.
    New search for: Martin, U.
    New search for: Heilmaier, M.
    New search for: Oettel, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Microstructure and room temperature hardening of ultra-fine-grained oxide-dispersion strengthened copper prepared by cryomilling

    Contributors:

    Kudashov, D. V. (author) / Baum, H. (author) / Martin, U. (author) / Heilmaier, M. (author) / Oettel, H. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 387/389 ; 768-771

    Publication date:

    2004-01-01

    Size:

    4 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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