Short communication Vacuum diffusion bonding of TiB~2 cermet to TiAl based alloys: Fid-Bau Portal

Short communication Vacuum diffusion bonding of TiB~2 cermet to TiAl based alloys

Li, Z. R. / Feng, J. C. / Cao, J.

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Short communication Vacuum diffusion bonding of TiB~2 cermet to TiAl based alloys

Li, Z. R. / Feng, J. C. / Cao, J.

Short communication Vacuum diffusion bonding of TiB~2 cermet to TiAl based alloys

Li, Z. R. / Feng, J. C. / Cao, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Short communication Vacuum diffusion bonding of TiB~2 cermet to TiAl based alloys

Contributors:

Li, Z. R. (author) / Feng, J. C. (author) / Cao, J. (author)

Published in:

MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 20 ; 1666-1668

Publication date:

2004-01-01

Size:

3 pages

ISSN:

0267-0836

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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