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    TiB~2/AIN/Cu Functionally Graded Materials (FGMs) Fabricated by Spark Plasma Sintering (SPS) Method

    New search for: Jin, S.
    New search for: Zhang, H.
    New search for: Li, J. F.
    New search for: Jia, S.
    New search for: Pan, W.
    New search for: Gong, J.
    New search for: Ge, C.-C.
    New search for: Li, J.-F.

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    TiB~2/AIN/Cu Functionally Graded Materials (FGMs) Fabricated by Spark Plasma Sintering (SPS) Method

    New search for: Jin, S.
    New search for: Zhang, H.
    New search for: Li, J. F.
    New search for: Jia, S.
    New search for: Pan, W.
    New search for: Gong, J.
    New search for: Ge, C.-C.
    New search for: Li, J.-F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    TiB~2/AIN/Cu Functionally Graded Materials (FGMs) Fabricated by Spark Plasma Sintering (SPS) Method

    New search for: Jin, S.
    New search for: Zhang, H.
    New search for: Li, J. F.
    New search for: Jia, S.
    New search for: Pan, W.
    New search for: Gong, J.
    New search for: Ge, C.-C.
    New search for: Li, J.-F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    TiB~2/AIN/Cu Functionally Graded Materials (FGMs) Fabricated by Spark Plasma Sintering (SPS) Method

    Contributors:

    Jin, S. (author) / Zhang, H. (author) / Li, J. F. (author) / Jia, S. (author) / Pan, W. / Gong, J. / Ge, C.-C. / Li, J.-F.

    Published in:

    High-Performance Ceramics III ; 1881-1884

    KEY ENGINEERING MATERIALS

    Publication date:

    2005-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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