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    Study on the Cure Kinetics of Middle Temperature Curing 3234 Epoxy Resin System

    New search for: Liu, T. S.
    New search for: Chen, X. B.
    New search for: Zhang, B. Y.

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    Study on the Cure Kinetics of Middle Temperature Curing 3234 Epoxy Resin System

    New search for: Liu, T. S.
    New search for: Chen, X. B.
    New search for: Zhang, B. Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Study on the Cure Kinetics of Middle Temperature Curing 3234 Epoxy Resin System

    New search for: Liu, T. S.
    New search for: Chen, X. B.
    New search for: Zhang, B. Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Study on the Cure Kinetics of Middle Temperature Curing 3234 Epoxy Resin System

    Contributors:

    Liu, T. S. (author) / Chen, X. B. (author) / Zhang, B. Y. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 475/479 ; 1041-1044

    Publication date:

    2005-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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