Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Guest Editorial - Device Packaging Conference

    New search for: Tessier, T. G.

    Access

    Access via TIB
    Check availability in my library

    Access

    Access via TIB
    Check availability in my library

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Guest Editorial - Device Packaging Conference

    New search for: Tessier, T. G.

    Access

    Access via TIB
    Check availability in my library

    Guest Editorial - Device Packaging Conference

    New search for: Tessier, T. G.

    Access

    Access via TIB
    Check availability in my library

    Access

    Access via TIB
    Check availability in my library

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Guest Editorial - Device Packaging Conference

    Contributors:

    Tessier, T. G. (author)

    Published in:

    ADVANCING MICROELECTRONICS ; 32 ; 6-6

    Publication date:

    2005-01-01

    Size:

    1 pages

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.381

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Guest Editorial: Medical Packaging

    Balde, J. | British Library Online Contents | 2002

    Guest editorial: Electronic materials, packaging technologies, and radiation reliability in advanced memory packaging

    DOAJ | 2023

    Free access

    Guest Editorial Developments in Thermal Materials and Processes for Semiconductor Packaging

    Saums, D. | British Library Online Contents | 2005

    Editorial - Guest Editorial

    Allen, Thomas R. | Online Contents | 2001

    Guest Editorial

    Brühwiler, Eugen / Feng, Peng / Moustafa, Mohamed et al. | SAGE Publications | 2024

    Back to top