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    Microstructure and Bend Ductility of W-0.3 mass%TiC Alloys Fabricated by Advanced Powder-Metallurgical Processing

    New search for: Ishijima, Y.
    New search for: Kurishita, H.
    New search for: Arakawa, H.
    New search for: Hasegawa, M.
    New search for: Hiraoka, Y.
    New search for: Takida, T.
    New search for: Takebe, K.

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    Microstructure and Bend Ductility of W-0.3 mass%TiC Alloys Fabricated by Advanced Powder-Metallurgical Processing

    New search for: Ishijima, Y.
    New search for: Kurishita, H.
    New search for: Arakawa, H.
    New search for: Hasegawa, M.
    New search for: Hiraoka, Y.
    New search for: Takida, T.
    New search for: Takebe, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure and Bend Ductility of W-0.3 mass%TiC Alloys Fabricated by Advanced Powder-Metallurgical Processing

    New search for: Ishijima, Y.
    New search for: Kurishita, H.
    New search for: Arakawa, H.
    New search for: Hasegawa, M.
    New search for: Hiraoka, Y.
    New search for: Takida, T.
    New search for: Takebe, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Microstructure and Bend Ductility of W-0.3 mass%TiC Alloys Fabricated by Advanced Powder-Metallurgical Processing

    Contributors:

    Ishijima, Y. (author) / Kurishita, H. (author) / Arakawa, H. (author) / Hasegawa, M. (author) / Hiraoka, Y. (author) / Takida, T. (author) / Takebe, K. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 46 ; 568-574

    Publication date:

    2005-01-01

    Size:

    7 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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