Deposition of Ti-Si-N Thin Films at the Bottom of Deep Hole by Pulsed-D.C. PCVD: Fid-Bau Portal

Deposition of Ti-Si-N Thin Films at the Bottom of Deep Hole by Pulsed-D.C. PCVD

Qingsong, M. / Shengli, M. / Kewei, X.

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Deposition of Ti-Si-N Thin Films at the Bottom of Deep Hole by Pulsed-D.C. PCVD

Qingsong, M. / Shengli, M. / Kewei, X.

Deposition of Ti-Si-N Thin Films at the Bottom of Deep Hole by Pulsed-D.C. PCVD

Qingsong, M. / Shengli, M. / Kewei, X.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Deposition of Ti-Si-N Thin Films at the Bottom of Deep Hole by Pulsed-D.C. PCVD

Contributors:

Qingsong, M. (author) / Shengli, M. (author) / Kewei, X. (author)

Published in:

RARE METAL MATERIALS AND ENGINEERING ; 34 ; 738-741

Publication date:

2005-01-01

Size:

4 pages

ISSN:

1002-185X

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 669

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