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    Characterization of the Electron Beam Curing of Cationic Polymerization of Diglycidylether of Bisphenol A Epoxy Resin

    New search for: Ribeiro, R.
    New search for: Morgan, R. J.
    New search for: Bonnaud, L.
    New search for: Lu, J.
    New search for: Sue, H.-J.
    New search for: Choi, J.
    New search for: Lopata, V.

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    Characterization of the Electron Beam Curing of Cationic Polymerization of Diglycidylether of Bisphenol A Epoxy Resin

    New search for: Ribeiro, R.
    New search for: Morgan, R. J.
    New search for: Bonnaud, L.
    New search for: Lu, J.
    New search for: Sue, H.-J.
    New search for: Choi, J.
    New search for: Lopata, V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Characterization of the Electron Beam Curing of Cationic Polymerization of Diglycidylether of Bisphenol A Epoxy Resin

    New search for: Ribeiro, R.
    New search for: Morgan, R. J.
    New search for: Bonnaud, L.
    New search for: Lu, J.
    New search for: Sue, H.-J.
    New search for: Choi, J.
    New search for: Lopata, V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Characterization of the Electron Beam Curing of Cationic Polymerization of Diglycidylether of Bisphenol A Epoxy Resin

    Contributors:

    Ribeiro, R. (author) / Morgan, R. J. (author) / Bonnaud, L. (author) / Lu, J. (author) / Sue, H.-J. (author) / Choi, J. (author) / Lopata, V. (author)

    Published in:

    JOURNAL OF COMPOSITE MATERIALS ; 39 ; 1433-1448

    Publication date:

    2005-01-01

    Size:

    16 pages

    ISSN:

    0021-9983

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.118

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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