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    Analysis of Cracking and Delamination of Sputtered Thin Films during Wear Process

    New search for: Nakasa, K.
    New search for: Setyanto, T. A.
    New search for: Zhang, B.
    New search for: Zheng, J. H.
    New search for: Kato, M.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

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    Analysis of Cracking and Delamination of Sputtered Thin Films during Wear Process

    New search for: Nakasa, K.
    New search for: Setyanto, T. A.
    New search for: Zhang, B.
    New search for: Zheng, J. H.
    New search for: Kato, M.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Analysis of Cracking and Delamination of Sputtered Thin Films during Wear Process

    New search for: Nakasa, K.
    New search for: Setyanto, T. A.
    New search for: Zhang, B.
    New search for: Zheng, J. H.
    New search for: Kato, M.
    New search for: Kim, Y.-J.
    New search for: Bae, D.-H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Analysis of Cracking and Delamination of Sputtered Thin Films during Wear Process

    Contributors:

    Nakasa, K. (author) / Setyanto, T. A. (author) / Zhang, B. (author) / Zheng, J. H. (author) / Kato, M. (author) / Kim, Y.-J. / Bae, D.-H.

    Published in:

    Advances in Fracture and Strength ; 1718-1723

    KEY ENGINEERING MATERIALS ; 297/300

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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