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Analysis of the Test Parameters in the Shear Test of BGA Solder Joints

Kim, J. W. / Park, S. K. / Jung, S. B.

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Analysis of the Test Parameters in the Shear Test of BGA Solder Joints

Kim, J. W. / Park, S. K. / Jung, S. B.

Analysis of the Test Parameters in the Shear Test of BGA Solder Joints

Kim, J. W. / Park, S. K. / Jung, S. B.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Analysis of the Test Parameters in the Shear Test of BGA Solder Joints

Contributors:

Kim, J. W. (author) / Park, S. K. (author) / Jung, S. B. (author) / Kim, Y.-J. / Bae, D.-H.

Published in:

Advances in Fracture and Strength ; 851-856

KEY ENGINEERING MATERIALS ; 297/300

Publication date:

2005-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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