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Quantitative measurements of subcritical debonding of Cu films from glass substrates
Quantitative measurements of subcritical debonding of Cu films from glass substrates
Quantitative measurements of subcritical debonding of Cu films from glass substrates
Pang, M. (author) / Baker, S. P. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 20 ; 2420-2431
2005-01-01
12 pages
Article (Journal)
English
DDC:
620.11
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