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Singular Thermal Residual Stress Field near the Interface Corner of Bonded Dissimilar Materials

Peng, N. L. / Yang, J. / Wang, M. Z.

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Singular Thermal Residual Stress Field near the Interface Corner of Bonded Dissimilar Materials

Peng, N. L. / Yang, J. / Wang, M. Z.

Singular Thermal Residual Stress Field near the Interface Corner of Bonded Dissimilar Materials

Peng, N. L. / Yang, J. / Wang, M. Z.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Singular Thermal Residual Stress Field near the Interface Corner of Bonded Dissimilar Materials

Contributors:

Peng, N. L. (author) / Yang, J. (author) / Wang, M. Z. (author)

Published in:

INTERNATIONAL JOURNAL OF FRACTURE ; 134 ; 387-397

Publication date:

2005-01-01

Size:

11 pages

ISSN:

0376-9429

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1126

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