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Study of Hole-Machining on Pyrex Wafer by Electrochemical Discharge Machining (ECDM)
Study of Hole-Machining on Pyrex Wafer by Electrochemical Discharge Machining (ECDM)
Study of Hole-Machining on Pyrex Wafer by Electrochemical Discharge Machining (ECDM)
Liao, Y. S. (author) / Peng, W. Y. (author) / Jywe, W. / Chen, C.-L. / Fan, K.-C. / Fung, R. F. / Hanson, S. G. / Hsieh, W.-H. / Hsu, C.-L. / Huang, Y.-M.
2006-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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