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The Cure and Thermal Behaviour of Mg(OH)~2/Epoxy Resin/DEEA Nanocomposites Prepared by a Novel Method Brief Communication
The Cure and Thermal Behaviour of Mg(OH)~2/Epoxy Resin/DEEA Nanocomposites Prepared by a Novel Method Brief Communication
The Cure and Thermal Behaviour of Mg(OH)~2/Epoxy Resin/DEEA Nanocomposites Prepared by a Novel Method Brief Communication
Yiyun, C. (author) / Pingsheng, H. (author) / Ronghui, C. (author)
POLYMERS AND POLYMER COMPOSITES ; 13 ; 835-838
2005-01-01
4 pages
Article (Journal)
English
DDC:
620.192
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