A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Quantitative Explanation for Uphill Diffusion of Sn during Reactive Diffusion between Cu-Sn Alloys and Nb
Quantitative Explanation for Uphill Diffusion of Sn during Reactive Diffusion between Cu-Sn Alloys and Nb
Quantitative Explanation for Uphill Diffusion of Sn during Reactive Diffusion between Cu-Sn Alloys and Nb
Yamashina, T. (author) / Kajihara, M. (author)
MATERIALS TRANSACTIONS ; 47 ; 829-837
2006-01-01
9 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Uphill diffusion in ternary Ni-Re-Ru alloys at 1000 and 1100degreeC
| British Library Online Contents | 2007
Suppression of uphill diffusion caused by phosphorus deactivation using carbon implantation
| British Library Online Contents | 2015
Suppression of uphill diffusion caused by phosphorus deactivation using carbon implantation
| British Library Online Contents | 2015
| British Library Online Contents | 2002
Reactive diffusion between Ag-Au alloys and Sn at solid-state temperatures
| British Library Online Contents | 2006