Contrast of Electroless Plating Ni-P and Ni-Cu-P Deposits: Fid-Bau Portal

Contrast of Electroless Plating Ni-P and Ni-Cu-P Deposits

Zhao, F.-x. / Liu, C. / Zhang, Z.-z. / Qiu, T.

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Contrast of Electroless Plating Ni-P and Ni-Cu-P Deposits

Zhao, F.-x. / Liu, C. / Zhang, Z.-z. / Qiu, T.

Contrast of Electroless Plating Ni-P and Ni-Cu-P Deposits

Zhao, F.-x. / Liu, C. / Zhang, Z.-z. / Qiu, T.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Contrast of Electroless Plating Ni-P and Ni-Cu-P Deposits

Contributors:

Zhao, F.-x. (author) / Liu, C. (author) / Zhang, Z.-z. (author) / Qiu, T. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 39 ; 65-68

Publication date:

2006-01-01

Size:

4 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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