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    Interdiffusion and Stress Development in Thin Film Diffusion Couples

    New search for: Kuru, Y.
    New search for: Chakraborty, J.
    New search for: Welzel, U.
    New search for: Wohlschlogel, M.
    New search for: Mittemeijer, E. J.
    New search for: Reimers, W.
    New search for: Quander, S.

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    Interdiffusion and Stress Development in Thin Film Diffusion Couples

    New search for: Kuru, Y.
    New search for: Chakraborty, J.
    New search for: Welzel, U.
    New search for: Wohlschlogel, M.
    New search for: Mittemeijer, E. J.
    New search for: Reimers, W.
    New search for: Quander, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interdiffusion and Stress Development in Thin Film Diffusion Couples

    New search for: Kuru, Y.
    New search for: Chakraborty, J.
    New search for: Welzel, U.
    New search for: Wohlschlogel, M.
    New search for: Mittemeijer, E. J.
    New search for: Reimers, W.
    New search for: Quander, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Interdiffusion and Stress Development in Thin Film Diffusion Couples

    Contributors:

    Kuru, Y. (author) / Chakraborty, J. (author) / Welzel, U. (author) / Wohlschlogel, M. (author) / Mittemeijer, E. J. (author) / Reimers, W. / Quander, S.

    Published in:

    Residual Stresses VII: ECRS 7 - Proceedings of the 7^t^h European Conference on Residual Stresses Berlin, Germany, 13-15 September 2006 ; 801-806

    MATERIALS SCIENCE FORUM ; 524/525

    Publication date:

    2006-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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