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    Curing Kinetics and Thermal Properties Characterization of o-Cresol-formaldehyde Epoxy Resin and MeTHPA System

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    New search for: Zhao, M.
    New search for: Li, Y.

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    Curing Kinetics and Thermal Properties Characterization of o-Cresol-formaldehyde Epoxy Resin and MeTHPA System

    New search for: Gao, J.
    New search for: Zhao, M.
    New search for: Li, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Curing Kinetics and Thermal Properties Characterization of o-Cresol-formaldehyde Epoxy Resin and MeTHPA System

    New search for: Gao, J.
    New search for: Zhao, M.
    New search for: Li, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Curing Kinetics and Thermal Properties Characterization of o-Cresol-formaldehyde Epoxy Resin and MeTHPA System

    Contributors:

    Gao, J. (author) / Zhao, M. (author) / Li, Y. (author)

    Published in:

    INTERNATIONAL JOURNAL OF POLYMERIC MATERIALS ; 55 ; 1009-1025

    Publication date:

    2006-01-01

    Size:

    17 pages

    ISSN:

    0091-4037

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.192

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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