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Antioxidation Behavior of Micron - Sized Copper Powders Coated with Electroless Silver Plating

Mei, B. / Qiao, X.-l. / Wang, H.-s. / Chen, J.-g. / Qiu, X.-l.

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Antioxidation Behavior of Micron - Sized Copper Powders Coated with Electroless Silver Plating

Mei, B. / Qiao, X.-l. / Wang, H.-s. / Chen, J.-g. / Qiu, X.-l.

Antioxidation Behavior of Micron - Sized Copper Powders Coated with Electroless Silver Plating

Mei, B. / Qiao, X.-l. / Wang, H.-s. / Chen, J.-g. / Qiu, X.-l.

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Access via TIB

Check availability in my library

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Document information

Title:

Antioxidation Behavior of Micron - Sized Copper Powders Coated with Electroless Silver Plating

Contributors:

Mei, B. (author) / Qiao, X.-l. (author) / Wang, H.-s. (author) / Chen, J.-g. (author) / Qiu, X.-l. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 39 ; 28-30

Publication date:

2006-01-01

Size:

3 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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