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    Thermal and mechanical properties of dough modeling compound reinforced ethylene propylene diene monomer/silicon rubber composites

    New search for: Wu, W.
    New search for: Chen, D.

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    Thermal and mechanical properties of dough modeling compound reinforced ethylene propylene diene monomer/silicon rubber composites

    New search for: Wu, W.
    New search for: Chen, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermal and mechanical properties of dough modeling compound reinforced ethylene propylene diene monomer/silicon rubber composites

    New search for: Wu, W.
    New search for: Chen, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Thermal and mechanical properties of dough modeling compound reinforced ethylene propylene diene monomer/silicon rubber composites

    Contributors:

    Wu, W. (author) / Chen, D. (author)

    Published in:

    POLYMER COMPOSITES ; 27 ; 621-626

    Publication date:

    2006-01-01

    Size:

    6 pages

    ISSN:

    0272-8397

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.192

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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