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    Screening of Quaternion Additive for Electroless Nickel Plating of Printed Circuit Board by Orthogonal Test

    New search for: Liu, H.-p.
    New search for: Li, N.
    New search for: Bi, S.-f.

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    Screening of Quaternion Additive for Electroless Nickel Plating of Printed Circuit Board by Orthogonal Test

    New search for: Liu, H.-p.
    New search for: Li, N.
    New search for: Bi, S.-f.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Screening of Quaternion Additive for Electroless Nickel Plating of Printed Circuit Board by Orthogonal Test

    New search for: Liu, H.-p.
    New search for: Li, N.
    New search for: Bi, S.-f.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Screening of Quaternion Additive for Electroless Nickel Plating of Printed Circuit Board by Orthogonal Test

    Contributors:

    Liu, H.-p. (author) / Li, N. (author) / Bi, S.-f. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN- ; 39 ; 30-32

    Publication date:

    2006-01-01

    Size:

    3 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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