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A platform for research: civil engineering, architecture and urbanism
Structural and Thermal Properties of Hot Pressed Cu/C Matrix Composites Materials Used for the Thermal Management of High Power Electronic Devices
Structural and Thermal Properties of Hot Pressed Cu/C Matrix Composites Materials Used for the Thermal Management of High Power Electronic Devices
Structural and Thermal Properties of Hot Pressed Cu/C Matrix Composites Materials Used for the Thermal Management of High Power Electronic Devices
Geffroy, P. M. (author) / Silvain, J. F. (author) / Yoon, D. Y. / Kang, S.-J. L. / Eun, K. Y. / Kim, Y.-S.
2007-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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