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Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying
Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying
Microstructure and Bonding Strength of Tungsten Coating Deposited on Copper by Plasma Spraying
Song, S. X. (author) / Zhou, Z. J. (author) / Du, J. (author) / Zhong, Z. H. (author) / Ge, C. C. (author) / Yoon, D. Y. / Kang, S.-J. L. / Eun, K. Y. / Kim, Y.-S.
2007-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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