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    Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect:

    New search for: LU, H.
    New search for: SHI, H. G.
    New search for: ZHOU, M.

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    Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect:

    New search for: LU, H.
    New search for: SHI, H. G.
    New search for: ZHOU, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect:

    New search for: LU, H.
    New search for: SHI, H. G.
    New search for: ZHOU, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect:

    Contributors:

    LU, H. (author) / SHI, H. G. (author) / ZHOU, M. (author)

    Published in:

    FATIGUE AND FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES ; 30 ; 87-94

    Publication date:

    2007-01-01

    Size:

    8 pages

    ISSN:

    8756-758X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1123

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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