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Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect:
Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect:
Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect:
LU, H. (author) / SHI, H. G. (author) / ZHOU, M. (author)
2007-01-01
8 pages
Article (Journal)
English
DDC:
620.1123
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