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    Influence of Vacancy Formation and Mg Migration on Cracking in Spot Welding AA5754 Alloys

    New search for: Wang, X. W.
    New search for: Zhang, H. Y.
    New search for: Sun, A. Q.
    New search for: Chandra, T.
    New search for: Tsuzaki, K.
    New search for: Militzer, M.
    New search for: Ravindran, C.

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    Influence of Vacancy Formation and Mg Migration on Cracking in Spot Welding AA5754 Alloys

    New search for: Wang, X. W.
    New search for: Zhang, H. Y.
    New search for: Sun, A. Q.
    New search for: Chandra, T.
    New search for: Tsuzaki, K.
    New search for: Militzer, M.
    New search for: Ravindran, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influence of Vacancy Formation and Mg Migration on Cracking in Spot Welding AA5754 Alloys

    New search for: Wang, X. W.
    New search for: Zhang, H. Y.
    New search for: Sun, A. Q.
    New search for: Chandra, T.
    New search for: Tsuzaki, K.
    New search for: Militzer, M.
    New search for: Ravindran, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Influence of Vacancy Formation and Mg Migration on Cracking in Spot Welding AA5754 Alloys

    Contributors:

    Wang, X. W. (author) / Zhang, H. Y. (author) / Sun, A. Q. (author) / Chandra, T. / Tsuzaki, K. / Militzer, M. / Ravindran, C.

    Published in:

    Supplement to THERMEC 2006, 5th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, July 4-8, 2006, Vancouver, Canada ; 433-437

    MATERIALS SCIENCE FORUM ; 539/543

    Publication date:

    2007-01-01

    Size:

    5 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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