Kinetic Features of Solid-State Reactive Diffusion between Au and Sn-Base Solder: Fid-Bau Portal

Kinetic Features of Solid-State Reactive Diffusion between Au and Sn-Base Solder

Kajihara, M. / Takenaka, T.

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Kinetic Features of Solid-State Reactive Diffusion between Au and Sn-Base Solder

Kajihara, M. / Takenaka, T.

Kinetic Features of Solid-State Reactive Diffusion between Au and Sn-Base Solder

Kajihara, M. / Takenaka, T.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Kinetic Features of Solid-State Reactive Diffusion between Au and Sn-Base Solder

Contributors:

Kajihara, M. (author) / Takenaka, T. (author) / Chandra, T. / Tsuzaki, K. / Militzer, M. / Ravindran, C.

Published in:

Supplement to THERMEC 2006, 5th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, July 4-8, 2006, Vancouver, Canada ; 2473-2478

MATERIALS SCIENCE FORUM ; 539/543

Publication date:

2007-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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