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    Effect of Load on the Abrasive Wear of Silica-Filled Epoxy Resin Composites

    New search for: Koh, S. W.
    New search for: Kim, H. J.
    New search for: Kim, J. D.
    New search for: Kim, B. T.
    New search for: Hwang, S. O.
    New search for: Choi, W. S.
    New search for: Kim, H.
    New search for: Hojo, J.
    New search for: Lee, S. W.

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    Effect of Load on the Abrasive Wear of Silica-Filled Epoxy Resin Composites

    New search for: Koh, S. W.
    New search for: Kim, H. J.
    New search for: Kim, J. D.
    New search for: Kim, B. T.
    New search for: Hwang, S. O.
    New search for: Choi, W. S.
    New search for: Kim, H.
    New search for: Hojo, J.
    New search for: Lee, S. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Load on the Abrasive Wear of Silica-Filled Epoxy Resin Composites

    New search for: Koh, S. W.
    New search for: Kim, H. J.
    New search for: Kim, J. D.
    New search for: Kim, B. T.
    New search for: Hwang, S. O.
    New search for: Choi, W. S.
    New search for: Kim, H.
    New search for: Hojo, J.
    New search for: Lee, S. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Effect of Load on the Abrasive Wear of Silica-Filled Epoxy Resin Composites

    Contributors:

    Koh, S. W. (author) / Kim, H. J. (author) / Kim, J. D. (author) / Kim, B. T. (author) / Hwang, S. O. (author) / Choi, W. S. (author) / Kim, H. / Hojo, J. / Lee, S. W.

    Published in:

    Eco-Materials Processing and Design VIII ; 255-258

    MATERIALS SCIENCE FORUM ; 544/545

    Publication date:

    2007-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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