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Direct Electroless Copper Plating on Polyimide for FPCB Applications

Lee, J. H.

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Direct Electroless Copper Plating on Polyimide for FPCB Applications

Lee, J. H.

Direct Electroless Copper Plating on Polyimide for FPCB Applications

Lee, J. H.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Direct Electroless Copper Plating on Polyimide for FPCB Applications

Contributors:

Lee, J. H. (author) / Kim, H. / Hojo, J. / Lee, S. W.

Published in:

Eco-Materials Processing and Design VIII ; 709-712

MATERIALS SCIENCE FORUM ; 544/545

Publication date:

2007-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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