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Modification of Thick-Film Conductors Used in IP Technology for Reduction of Warpage during Co-Firing of LTCC (Low Temperature Co-Fired Ceramic) Modules
Modification of Thick-Film Conductors Used in IP Technology for Reduction of Warpage during Co-Firing of LTCC (Low Temperature Co-Fired Ceramic) Modules
Modification of Thick-Film Conductors Used in IP Technology for Reduction of Warpage during Co-Firing of LTCC (Low Temperature Co-Fired Ceramic) Modules
Birol, H. (author) / Maeder, T. (author) / Ryser, P. (author) / Pan, W. / Gong, J.
2007-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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