Thermal Expansion Behavior of Solid Solution Y~1~.~9R~0~.~1Mo~4O~1~5 (R = Sm, Nd, Dy): Fid-Bau Portal

Thermal Expansion Behavior of Solid Solution Y~1~.~9R~0~.~1Mo~4O~1~5 (R = Sm, Nd, Dy)

Wang, H. / Peng, J. / Cheng, Y. / Wu, M. / Hu, Z. / Yu, Z. / Chen, D.

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Thermal Expansion Behavior of Solid Solution Y~1~.~9R~0~.~1Mo~4O~1~5 (R = Sm, Nd, Dy)

Wang, H. / Peng, J. / Cheng, Y. / Wu, M. / Hu, Z. / Yu, Z. / Chen, D.

Thermal Expansion Behavior of Solid Solution Y~1~.~9R~0~.~1Mo~4O~1~5 (R = Sm, Nd, Dy)

Wang, H. / Peng, J. / Cheng, Y. / Wu, M. / Hu, Z. / Yu, Z. / Chen, D.

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Title:

Thermal Expansion Behavior of Solid Solution Y~1~.~9R~0~.~1Mo~4O~1~5 (R = Sm, Nd, Dy)

Contributors:

Wang, H. (author) / Peng, J. (author) / Cheng, Y. (author) / Wu, M. (author) / Hu, Z. (author) / Yu, Z. (author) / Chen, D. (author) / Pan, W. / Gong, J.

Published in:

Proceedings of the Fourth China International Conference on High-Performance Ceramics (CICC-4) (Incorporating the Second International Workshop on Layered and Graded Materials and the First Satellite Symposium on Thermoelectrics) Chengdu, China, October 23 ∼ 26, 2005 ; 2328-2330

KEY ENGINEERING MATERIALS ; 336/338

Publication date:

2007-01-01

Size:

3 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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