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    Numerical analysis for migration of interface between liquid and solid phases during reactive diffusion in the binary Cu-Al system

    New search for: Tanaka, Y.
    New search for: Kajihara, M.

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    Numerical analysis for migration of interface between liquid and solid phases during reactive diffusion in the binary Cu-Al system

    New search for: Tanaka, Y.
    New search for: Kajihara, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Numerical analysis for migration of interface between liquid and solid phases during reactive diffusion in the binary Cu-Al system

    New search for: Tanaka, Y.
    New search for: Kajihara, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
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    Document information
    Title:

    Numerical analysis for migration of interface between liquid and solid phases during reactive diffusion in the binary Cu-Al system

    Contributors:

    Tanaka, Y. (author) / Kajihara, M. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 459 ; 101-110

    Publication date:

    2007-01-01

    Size:

    10 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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