A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Die-attach Materials and Processes: This segment examines a replacement material for solder in die-attach processes that can be processed using conventional methods
Die-attach Materials and Processes: This segment examines a replacement material for solder in die-attach processes that can be processed using conventional methods
Die-attach Materials and Processes: This segment examines a replacement material for solder in die-attach processes that can be processed using conventional methods
Thomas, M. (author)
ADVANCED PACKAGING ; 16 ; 32-36
2007-01-01
5 pages
Article (Journal)
English
DDC:
658.564
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