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Development of New Evaluation Method for Adhesive Strength between Microsized Photoresist and Si Substrate of MEMS Devices
Development of New Evaluation Method for Adhesive Strength between Microsized Photoresist and Si Substrate of MEMS Devices
Development of New Evaluation Method for Adhesive Strength between Microsized Photoresist and Si Substrate of MEMS Devices
Ishiyama, C. (author) / Sone, M. (author) / Higo, Y. (author) / Nam, S. W. / Chang, Y. W. / Lee, S. B. / Kim, N. J.
The Mechanical Behavior of Materials X ; 1185-1188
KEY ENGINEERING MATERIALS ; 345/346
2007-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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