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Injection moulding of alumina with partially water soluble binder system and solvent debinding kinetics
Injection moulding of alumina with partially water soluble binder system and solvent debinding kinetics
Injection moulding of alumina with partially water soluble binder system and solvent debinding kinetics
Bakan, H. I. (author)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 23 ; 787-791
2007-01-01
5 pages
Article (Journal)
English
DDC:
620.11
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