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    Tribological Behavior of DLC Films by RF-PECVD at the Elevated Temperature

    New search for: Cho, Y.K.
    New search for: Shin, Y.H.
    New search for: Jeong, S.H.
    New search for: Lee, Y.Z.
    New search for: Zhou, Y.
    New search for: Tu, S.-T.
    New search for: Xie, X.

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    Tribological Behavior of DLC Films by RF-PECVD at the Elevated Temperature

    New search for: Cho, Y.K.
    New search for: Shin, Y.H.
    New search for: Jeong, S.H.
    New search for: Lee, Y.Z.
    New search for: Zhou, Y.
    New search for: Tu, S.-T.
    New search for: Xie, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Tribological Behavior of DLC Films by RF-PECVD at the Elevated Temperature

    New search for: Cho, Y.K.
    New search for: Shin, Y.H.
    New search for: Jeong, S.H.
    New search for: Lee, Y.Z.
    New search for: Zhou, Y.
    New search for: Tu, S.-T.
    New search for: Xie, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
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    Document information
    Title:

    Tribological Behavior of DLC Films by RF-PECVD at the Elevated Temperature

    Contributors:

    Cho, Y.K. (author) / Shin, Y.H. (author) / Jeong, S.H. (author) / Lee, Y.Z. (author) / Zhou, Y. / Tu, S.-T. / Xie, X.

    Published in:

    Progresses in Fracture and Strength of Materials and Structures: Part 3: Selected, peer reviewed papers from the Asian Pacific Conference Fracture and Strength 2006 (APCFS'06), held at Sanya, Hainan Island, China during November 22˜25, 2006 ; 1781-1784

    KEY ENGINEERING MATERIALS ; 353/358

    Publication date:

    2007-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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