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    Three-Dimensional Finite Element Modelling of Laser Shock Peening Process

    New search for: Yang, C.H.
    New search for: Hodgson, P.D.
    New search for: Liu, Q.C.
    New search for: Ye, L.
    New search for: Chang, Y.W.
    New search for: Kim, N.J.
    New search for: Lee, C.S.

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    Three-Dimensional Finite Element Modelling of Laser Shock Peening Process

    New search for: Yang, C.H.
    New search for: Hodgson, P.D.
    New search for: Liu, Q.C.
    New search for: Ye, L.
    New search for: Chang, Y.W.
    New search for: Kim, N.J.
    New search for: Lee, C.S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Three-Dimensional Finite Element Modelling of Laser Shock Peening Process

    New search for: Yang, C.H.
    New search for: Hodgson, P.D.
    New search for: Liu, Q.C.
    New search for: Ye, L.
    New search for: Chang, Y.W.
    New search for: Kim, N.J.
    New search for: Lee, C.S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Three-Dimensional Finite Element Modelling of Laser Shock Peening Process

    Contributors:

    Yang, C.H. (author) / Hodgson, P.D. (author) / Liu, Q.C. (author) / Ye, L. (author) / Chang, Y.W. / Kim, N.J. / Lee, C.S.

    Published in:

    PRICM 6 Part 3 Selected, peer reviewed papers from The Sixth Pacific Rim International Conference on Advanced Materials and Processing, November 5-9, 2007, ICC Jeju, Jeju Island, Korea ; 2261-2264

    MATERIALS SCIENCE FORUM ; 561/565

    Publication date:

    2007-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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