Grain boundary strengthening in copper/niobium multilayered foils and fine-grained niobium: Fid-Bau Portal

Grain boundary strengthening in copper/niobium multilayered foils and fine-grained niobium

Lewis, A.C. / Eberl, C. / Hemker, K.J. / Weihs, T.P.

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Grain boundary strengthening in copper/niobium multilayered foils and fine-grained niobium

Lewis, A.C. / Eberl, C. / Hemker, K.J. / Weihs, T.P.

Grain boundary strengthening in copper/niobium multilayered foils and fine-grained niobium

Lewis, A.C. / Eberl, C. / Hemker, K.J. / Weihs, T.P.

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Check availability in my library

Order at Subito €

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Document information

Title:

Grain boundary strengthening in copper/niobium multilayered foils and fine-grained niobium

Contributors:

Lewis, A.C. (author) / Eberl, C. (author) / Hemker, K.J. (author) / Weihs, T.P. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 376-382

Publication date:

2008-01-01

Size:

7 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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