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Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size

Zhang, H. / Jiang, Z. / Lian, J. / Jiang, Q.

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Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size

Zhang, H. / Jiang, Z. / Lian, J. / Jiang, Q.

Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size

Zhang, H. / Jiang, Z. / Lian, J. / Jiang, Q.

Access

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size

Contributors:

Zhang, H. (author) / Jiang, Z. (author) / Lian, J. (author) / Jiang, Q. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 479 ; 136-141

Publication date:

2008-01-01

Size:

6 pages

ISSN:

Type of media:

Article (Journal)

Type of material:

Print

Language:

English

Classification:

© Metadata Copyright the British Library Board and other contributors. All rights reserved.

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