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On the elevated-temperature deformation behavior of polycrystalline Cu subjected to predeformation by multiple compression
On the elevated-temperature deformation behavior of polycrystalline Cu subjected to predeformation by multiple compression
On the elevated-temperature deformation behavior of polycrystalline Cu subjected to predeformation by multiple compression
Li, Y. J. (author) / Zeng, X. H. (author) / Blum, W. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 483/484 ; 547-550
2008-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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