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Cleavage cracking across triple grain boundary junctions in freestanding silicon thin films

Chen, J. / Qiao, Y.

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Cleavage cracking across triple grain boundary junctions in freestanding silicon thin films

Chen, J. / Qiao, Y.

Cleavage cracking across triple grain boundary junctions in freestanding silicon thin films

Chen, J. / Qiao, Y.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Cleavage cracking across triple grain boundary junctions in freestanding silicon thin films

Contributors:

Chen, J. (author) / Qiao, Y. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 1647-1651

Publication date:

2008-01-01

Size:

5 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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Sursaeva, V. G. / Czubayko, U. / Gottstein, G. et al. | British Library Online Contents | 1999

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