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Reliability estimation of solder joints under thermal fatigue with varying parameters by using FORM and MCS

Lee, O. S. / Park, Y. C. / Kim, D. H.

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Reliability estimation of solder joints under thermal fatigue with varying parameters by using FORM and MCS

Lee, O. S. / Park, Y. C. / Kim, D. H.

Reliability estimation of solder joints under thermal fatigue with varying parameters by using FORM and MCS

Lee, O. S. / Park, Y. C. / Kim, D. H.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

Similar titles

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Document information

Title:

Reliability estimation of solder joints under thermal fatigue with varying parameters by using FORM and MCS

Contributors:

Lee, O. S. (author) / Park, Y. C. (author) / Kim, D. H. (author)

Published in:

JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 22 ; 683-688

Publication date:

2008-01-01

Size:

6 pages

ISSN:

1738-494X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621

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