A platform for research: civil engineering, architecture and urbanism
A Local, Reactive Heat Source for Room Temperature Soldering of High Power Devices to Substrates
A Local, Reactive Heat Source for Room Temperature Soldering of High Power Devices to Substrates
A Local, Reactive Heat Source for Room Temperature Soldering of High Power Devices to Substrates
He, Z. ( author ) / Vincent, R. ( author ) / Besnoin, E. ( author ) / Van Heerden, D. ( author )
ADVANCING MICROELECTRONICS ; 35 ; 16-19
2008-01-01
4 pages
Article (Journal)
English
DDC:
621.381
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
NanoBond® Assembly - A Rapid, Room Temperature Soldering Process
British Library Online Contents | 2009
|SiC Power Devices: Product Improvement Using Diffusion Soldering
British Library Online Contents | 2009
|Laser soldering of surface-mounted devices for high-reliability applications
British Library Online Contents | 1993
|Induction devices for assembly soldering in electronics
British Library Online Contents | 2012
|