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    Fatigue and fracture assessment for reliability in electronics packaging

    New search for: Lee, S. B.
    New search for: Kim, I.
    New search for: Park, T. S.

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    Fatigue and fracture assessment for reliability in electronics packaging

    New search for: Lee, S. B.
    New search for: Kim, I.
    New search for: Park, T. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Fatigue and fracture assessment for reliability in electronics packaging

    New search for: Lee, S. B.
    New search for: Kim, I.
    New search for: Park, T. S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Fatigue and fracture assessment for reliability in electronics packaging

    Contributors:

    Lee, S. B. (author) / Kim, I. (author) / Park, T. S. (author)

    Published in:

    INTERNATIONAL JOURNAL OF FRACTURE ; 150 ; 91-104

    Publication date:

    2008-01-01

    Size:

    14 pages

    ISSN:

    0376-9429

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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