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    High-temperature mechanical behavior/microstructure correlation of Cu/Nb nanoscale multilayers

    New search for: Mara, N. A.
    New search for: Misra, A.
    New search for: Hoagland, R. G.
    New search for: Sergueeva, A. V.
    New search for: Tamayo, T.
    New search for: Dickerson, P.
    New search for: Mukherjee, A. K.

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    High-temperature mechanical behavior/microstructure correlation of Cu/Nb nanoscale multilayers

    New search for: Mara, N. A.
    New search for: Misra, A.
    New search for: Hoagland, R. G.
    New search for: Sergueeva, A. V.
    New search for: Tamayo, T.
    New search for: Dickerson, P.
    New search for: Mukherjee, A. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    High-temperature mechanical behavior/microstructure correlation of Cu/Nb nanoscale multilayers

    New search for: Mara, N. A.
    New search for: Misra, A.
    New search for: Hoagland, R. G.
    New search for: Sergueeva, A. V.
    New search for: Tamayo, T.
    New search for: Dickerson, P.
    New search for: Mukherjee, A. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    High-temperature mechanical behavior/microstructure correlation of Cu/Nb nanoscale multilayers

    Contributors:

    Mara, N. A. (author) / Misra, A. (author) / Hoagland, R. G. (author) / Sergueeva, A. V. (author) / Tamayo, T. (author) / Dickerson, P. (author) / Mukherjee, A. K. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 493 ; 274-282

    Publication date:

    2008-01-01

    Size:

    9 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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